中信建投:半导体设备零部件国产化斜率最高方向

智通财经
11 hours ago
【中信建投:半导体设备零部件国产化斜率最高方向】中信建投研报认为,本轮半导体景气周期由AI需求驱动,全球存储厂盈利与资本开支同步创出历史新高,扩产力度超过以往任何一轮周期,其中设备零部件需求兼备扩产与存量替换需求;供给端国内设备整机厂与主产业链已具备全球影响力,但细分零部件与材料成为产业链最后攻坚堡垒;当前外部政治环境复杂,出口管控力度升级,交期不断拉长;国家大基金三期定向投向半导体设备零部件与材料,加大本土孵化力度; 我们以国产化剪刀差、垄断强度为标准,认为MFC、空白掩膜版、静电卡盘产业链具备更高国产化斜率。

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