【芯联集成完成对芯联先进实缴出资 布局硅光等高端模拟芯片】芯联集成公告，已累计实缴注册资本21.29亿元，完成对合资公司芯联先进全部认缴出资，持股比例25.1%，位列第一大股东。该投资用于推进“四期项目”建设，目标建成月产能5万片的12英寸车规级数模混合芯片生产线，技术聚焦40/28nm MCU/DSP、90/55nm BCD/Dr MOS及55nm硅光等高端模拟芯片。据披露，四期项目计划总投资约200亿元，其中资本金120亿元。
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