相关需求呈爆发式增长,消息称台积电计划新增 5 座先进封装工厂

IT之家
Sep 27

IT之家 9 月 27 日消息,据台媒自由时报消息,半导体供应链消息称,台积电计划在嘉义科学园区新增 5 座先进芯片封装工厂。资料显示,台积电在嘉科一期已规划 P1 与 P2 两座先进封装厂,其中 P1 厂已实现量产,P2 厂已进入设备安装阶段;嘉科二期则规划了 P3、P4 和 P5 厂房,其中 P3 厂已顺利开工,计划于 2031 年前完成二期全部建厂任务。据悉,随着英伟达、AMD 及苹果等全球...

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