据外媒报道,英伟达正考虑采用玻璃基板,并与德国设备制造商SCHMID及其他公司合作,以期将人工智能芯片的性能提升到一个新水平。 韩媒《首尔经济日报》24日报道称,英伟达该战略旨在通过增加可安装的高带宽内存(HBM)容量,大幅提高数据处理速度。 《首尔经济日报》援引Investing报道,SCHMID在最近一次上半年财报发布会上披露,该公司正与英特尔、英伟达和AMD各自供应链中的关键供应商...
Source Link据外媒报道,英伟达正考虑采用玻璃基板,并与德国设备制造商SCHMID及其他公司合作,以期将人工智能芯片的性能提升到一个新水平。 韩媒《首尔经济日报》24日报道称,英伟达该战略旨在通过增加可安装的高带宽内存(HBM)容量,大幅提高数据处理速度。 《首尔经济日报》援引Investing报道,SCHMID在最近一次上半年财报发布会上披露,该公司正与英特尔、英伟达和AMD各自供应链中的关键供应商...
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