金吾财讯 | 恩智浦半导体（NXP）宣布其与Vanguard International Semiconductor于2024年成立的合资企业VSMC（位于新加坡淡滨尼）的首座12英寸（300mm）晶圆厂正式落成。目前，该厂房建设已竣工并进入风险试产阶段，首批样品良率超过99%，计划于2027年第一季度正式开始量产，并预计到2029年全面达产后，月产能将达4.4万片12英寸晶圆，并创造约1,600个就业岗位。据悉，该厂采用自动化智能制造模式，制程覆盖130nm至40nm，重点服务混合信号、电源管理及模拟芯片等领域，支撑车规、工业及高性能计算等终端市场。此举旨在强化恩智浦的全球供应链弹性。
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