台积电参股的晶圆代工厂世界先进与欧洲芯片巨头恩智浦合资成立的 VSMC 新加坡首座 12 吋晶圆厂于 9 月 28 日正式举行启用典礼，预计在 2027 年第一季度开始量产，并在 2029 年达到月产 44,000 片晶圆的满载产能。该厂专注于 40 至 130 纳米成熟特殊制程，投产后将创造约 1,600 个高科技工作岗位，并符合 LEED 与 Green Mark 绿色建筑标准。
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