【SK海力士扩大存储半导体倒装芯片封装外包规模】SK海力士扩大存储半导体倒装芯片封装外包规模,继OSAT供应商A-PROTECH之后,SK海力士开始将更多业务外包给WINPAC,这是两家公司上次合作四年后再次合作。SK海力士计划将部分DDR4、DDR5 DRAM内存芯片封装订单交由Winpac承接,Winpac已在P围区封装工厂完成设备调试等产线投产准备,现已进入量产阶段。该围区负责DRAM、NAND闪存、eUFS嵌入式通用闪存等高性能产品封装,月产能已由4400万颗提升至5000万颗。
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