金吾财讯 | 据外媒援引知情人士透露，全球晶圆代工巨头台积电（TSM）正评估在美投资的最新选择，拟在德克萨斯州建设新厂，以进一步拓展其在美国的芯片制造产能。若该计划落地，相关资金投入将超越其此前向亚利桑那州承诺的2650亿美元总投资额。目前，台积电尚未对该投资消息做出正式回应。数据显示，台积电近期已加大赴美投资力度，包括追加1000亿美元规划新增四座半导体制造及封装工厂，使其亚利桑那州园区的工厂总数增至12家。其中，凤凰城首家工厂已量产4纳米芯片，第二家工厂则计划于明年下半年推进3纳米先进制程量产。华尔街投行富国银行分析指出，拥有“硅草原”之称的德克萨斯州具备成熟的半导体产业集群与供应链配套，是建设第二大生产园区的理想地点。随着台积电在美加速拓展2纳米及更先进制程产能，半导体前端设备与封测产业链供应商有望迎来新一轮订单红利。
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