人工智能芯片需求激增，也让三星电子的晶圆代工业务受益。目前AI芯片产能高度集中于台积电，越来越多客户寻求分散订单，助力三星电子稳住全球晶圆代工市场第二名的位置。
市场研究机构Counterpoint于30日发布数据，今年二季度三星电子占据全球晶圆代工市场约4%份额，仅次于台积电。公司4纳米与5纳米工艺（SF4、SF5制程）需求旺盛，叠加晶圆价格上涨，支撑了该业绩。
不过三星与台积电之间差距依旧巨大。台积电二季度营收402亿美元（约合54万亿韩元），同比增长34%，约占整个代工2.0市场的42%。Counterpoint表示，三星电子与英特尔正在承接客户寻找备选供应商带来的订单，但在先进制程产能、良率以及先进封装能力方面，二者仍难以替代台积电。
行业竞争重心预计将从晶圆制造拓展至先进封装领域。Counterpoint预测，代工2.0市场下半年将维持两位数增长，封装、基板与测试产能将成为扩大AI芯片供给的关键变量。
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