英伟达欲加码玻璃基板决战AI先进封装 A股相关企业抢先布局

中国经营报
Oct 08

英伟达正在加码玻璃基板,试图为下一代GPU找到新的封装底座。  日前,有消息称英伟达正在评估玻璃基板方案,并与德国设备厂商SCHMID等企业推进相关设备开发,还希望韩国、日本等面板厂商在两年内完成玻璃基板开发。而SCHMID在财报会上也披露,其正与英伟达、英特尔、AMD供应链中的核心企业共同开发玻璃基板设备,但SCHMID高管指出,玻璃通孔(TGV)的金属化环节仍存在技术难点,客户认证尚未完成。 ...

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