格罗方德将为台积电生产关键的人工智能芯片组件

路透中文
Oct 08
格罗方德将为<a href="https://laohu8.com/S/TSM">台积电</a>生产关键的人工智能芯片组件

路透10月8日 - 格罗方德(GlobalFoundries) GFS.O 周四表示,将在其纽约工厂为台积电(TSMC) 2330.TW 生产一种用于连接人工智能处理器和内存芯片的关键组件。

该组件被称为硅中介层,位于先进AI封装内的处理器和内存芯片下方,可实现它们之间的高速通信。

  • 根据这项为期五年的协议,格罗方德将扩大其位于纽约马耳他工厂的生产能力,为台积电生产该组件

  • 该公司表示,马耳他工厂有望成为美国境内首个用于先进芯片封装技术的硅中介层生产基地

  • GlobalFoundries的股价在盘前交易中上涨了约4%

  • 随着对先进封装技术需求的增长,该协议为未来的产能扩张提供了框架,预计量产将于2028年上半年开始逐步提升

  • 随着对先进封装技术的需求超过现有制造产能,先进封装已成为人工智能芯片生产的主要瓶颈

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