中信建投:TLVR芯片电感单位价值量提升 行业空间极速扩容

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【中信建投:TLVR芯片电感单位价值量提升 行业空间极速扩容】中信建投证券研报称,多相TLVR电感是大势所趋。AI芯片电感未来三大产业趋势:1.单相电感走向多相电感,密度提升;2.水平供电转向VPD垂直供电,供电效率提升;3.USON-TTLVR转向TLVR电感,价值量提升。多相TLVR电感将成为必须。AI芯片电感从2025年到2028年市场规模扩容10倍以上。未来芯片电感面临多重驱动,随着AI芯片出货增加、芯片功率上升、电感性能升级,AI芯片电感市场规模将快速扩容,规模增速=芯片出货倍数×功率提升倍数×单颗价值提升倍数。

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