韩国半导体展14日启幕 HBM、物理AI芯片成核心看点

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【韩国半导体展14日启幕 HBM、物理AI芯片成核心看点】韩国半导体产业协会10月12日表示,第28届韩国半导体展览会将于10月14日至16日举办,展会主题为“走进硅基智能时代”。本届展会规模创下历史新高,共有300家企业参展,较去年增加约70家,搭建888个展位。 三星电子将围绕“AI系统设计”核心主题,展示高带宽内存以及下一代三维内存技术。同时还将展出移动图像传感器、处理器、车载芯片与晶圆代工解决方案,全面展示其在内存、系统半导体以及先进封装领域的综合实力。 SK海力士将发布下一代HBM4E与高带宽闪存技术,同时展出服务器、PC、移动端DRAM、NAND闪存、固态硬盘等旗舰产品。

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