格芯与台积电达成20亿美元协议,将在纽约为后者生产AI芯片关键组件

路透中文
Oct 09
格芯与<a href="https://laohu8.com/S/TSM">台积电</a>达成20亿美元协议,将在纽约为后者生产AI芯片关键组件

路透10月8日 - 格芯(GlobalFoundries) GFS.O 周四表示,已达成一项价值20亿美元的协议,将在其纽约工厂为台积电(TSMC) 2330.TW 生产一种用于连接人工智能(AI)处理器和存储芯片的关键组件。

该组件被称为硅中介层(silicon interposer),位于先进AI封装内部的处理器和存储芯片下方,使两者能够进行高速数据传输。

  • 根据这项为期五年的协议,格芯将扩建其位于纽约州马耳他工厂的产能,为台积电生产该组件

  • 该公司表示,马耳他工厂有望成为美国首个先进芯片封装技术所用硅中介层的生产基地

  • 随着对先进封装需求的增长,该协议为未来进一步产能扩张提供了框架;预计量产规模将在2028年上半年开始提升

  • 随着对先进封装的需求超过现有产能,先进封装已成为AI芯片生产的主要制约因素

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