长鑫技术新突破:4F²架构产品预计年底亮相

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【长鑫技术新突破:4F²架构产品预计年底亮相】记者获悉,长鑫存储4F² DRAM架构研发近期取得关键进展。该公司总裁曹堪宇博士在第四届集成芯片和芯粒大会上发表演讲,全面介绍了长鑫存储在DRAM器件、4F²架构及混合键合等方向的技术探索与积累,并官宣预计年底将推出融合了上述先进技术的新一代DDR5 RDIMM产品。

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