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韩国《首尔经济日报》援引未具名业内人士消息报道,三星电子计划使用台积电3纳米工艺,为英伟达下一代定制高带宽内存生产基底裸片。
英伟达已要求三星、SK海力士和美光,在其定制NVHBM产品的基底裸片生产上统一采用台积电3纳米工艺。
英伟达希望各供应商统一制造流程,保障产品性能一致。
此举是三星首次在HBM制造环节与台积电开展合作。
NVHBM基于第七代HBM4E架构开发。
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