据马斯克透露,阿斯麦及其他主要半导体制造设备供应商,已加快向特斯拉与SpaceX的Terafab芯片项目交付设备。马斯克

智通财经
Oct 21
据马斯克透露,阿斯麦及其他主要半导体制造设备供应商,已加快向特斯拉与SpaceX的Terafab芯片项目交付设备。马斯克在SpaceX第三季度财报电话会议上表示:“这些时间安排非常紧迫,我们非常感谢阿斯麦及所有其他供应商加快设备交付,以帮助我们实现这一目标。”Terafab是马斯克为特斯拉和SpaceX规划的大规模芯片制造项目。该项目旨在满足两家公司对AI处理器及其他芯片的巨大需求,弥补包括台积电在内的现有供应商在先进芯片供应方面的不足。马斯克表示,SpaceX的目标是在2028年第三季度或第四季度,实现Terafab工厂的芯片大规模量产。

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