美股詳情

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Cambria Global Asset Allocation ETF

28.88

+0.08030.28%

盤後：28.930.0549+0.19%16:05 EDT

成交量：742.00

成交額：2.15萬

市值：5,341.88萬

市盈率：- -

高：28.93

開：28.89

低：28.88

收：28.79

資料載入中...

總覽公司新聞公告

FinFET，走到盡頭，新王將登基！

半导体行业观察

臺積電公佈A14製程工藝：第二代GAA晶體管，計劃2028年投產

黃仁勳預測：GAA技術助力NVIDIA新GPU，2028年性能提升20%，未來科技觸手可及

2nm戰場，好戲來了

Ofweek维科网

英偉達黃仁勳：GAA工藝或僅帶來20%性能提升，架構與軟件創新更為關鍵

英偉達CEO黃仁勳：GAA晶體管或帶來20%性能提升但架構創新仍是關鍵

三星全力研發Exynos 2600芯片確保Galaxy S26系列按時上市

中关村在线

2nm工藝大考倒計時

1nm，重要進展

半导体芯闻

晶圓廠，大砍資本支出

2nm工藝取得突破 Rapidus與IBM合作成功製造GAA晶體管原型晶圓

ZOL中关村在线

Rapidus 與 IBM 合作在美製造 2nm GAA 原型晶圓亮相，在日試產 4 月啓動

2nm，要來了

Ofweek光电信息网

晶圓代工釋放新信號

全球半导体观察

0.7nm工藝，最新分享

半导体行业观察

半導體未來三大支柱：先進封裝、晶體管和互連

2nm，勝負已分？

华尔街见闻

中國芯片出口額，突破萬億

华尔街见闻

SRAM，還沒死！

半导体行业观察

{"basename":"/hant","ssrTDKData":{"titleTemplate":"%s - 老虎證券","title":"老虎证券全球投资理财平台| 一站式投资美股新股港股A股","description":"老虎证券助您一站式投资美股，新股，港股，A股等全球金融理财产品。新加坡华人最信赖的在线投资平台，现在加入即享低费用，24/5 无时差炒美股投资理财！","keywords":"老虎證券,老虎證券開戶,老虎券商,老虎證券官網,老虎證券app,tigertrade老虎證券,股票,炒股,新加坡股票交易平臺,投資,投資理財","social":{"ogDescription":"老虎证券助您一站式投资美股，新股，港股，A股等全球金融理财产品。新加坡华人最信赖的在线投资平台，现在加入即享低费用，24/5 无时差炒美股投资理财！","ogImage":"https://c1.itigergrowtha.com/portal5/static/media/og-logo.be62fbe1.png","ogUrl":"https://www.itiger.com/hant/stock/GAA/news"},"companyName":"老虎證券"},"pageData":{"isMobile":false,"isTiger":false,"isTTM":true,"region":"SGP","license":"TBSG","edition":"fundamental","symbol":"GAA","isAnalysisPage":false},"__swrFallback__":{"@#url:\"https://hq.skytigris.cn/stock_info/detail/global\",params:#delay:false,,method:\"POST\",data:#items:@#symbol:\"GAA\",,,,,undefined,":{"symbol":"GAA","market":"US","secType":"STK","nameCN":"Cambria Global Asset Allocation ETF","latestPrice":28.875,"timestamp":1746129600000,"preClose":28.7947,"halted":0,"volume":742,"hourTrading":{"tag":"盘后","latestPrice":28.9299,"preClose":28.875,"latestTime":"16:05 EDT","volume":3,"amount":86.625,"timestamp":1746129913330},"delay":0,"floatShares":1850001,"shares":1850001,"eps":0,"marketStatus":"已收盤","change":0.0803,"latestTime":"05-01 16:00:00 EDT","open":28.89,"high":28.9299,"low":28.875,"amount":21452.0263,"amplitude":0.001907,"askPrice":0,"askSize":0,"bidPrice":0,"bidSize":0,"shortable":3,"etf":1,"ttmEps":0,"tradingStatus":0,"nextMarketStatus":{"tag":"盤前交易","tradingStatus":1,"beginTime":1746172800000},"marketStatusCode":5,"adr":0,"adrRate":0,"exchange":"ARCA","adjPreClose":28.7947,"sharesOutstanding":1850001,"nav":29.04,"aum":53724029.04,"bidAskSpread":0.006503,"postHourTrading":{"tag":"盘后","latestPrice":28.9299,"preClose":28.875,"latestTime":"16:05 EDT","volume":3,"amount":86.625,"timestamp":1746129913330},"volumeRatio":0.085016},"@#url:\"https://hq.skytigris.cn/stock_info/fundamental/all\",params:#delay:false,,method:\"POST\",data:#items:@#symbol:\"GAA\",,,,,undefined,":{"symbol":"GAA","floatShares":1850001,"roa":"--","roe":"--","lyrEps":0,"volumeRatio":0.085016,"shares":1850001,"dividePrice":1.20812,"high":28.9299,"amplitude":0.001907,"preClose":28.7947,"low":28.875,"week52Low":26.8,"pbRate":"--","week52High":30.1,"institutionHeld":0,"latestPrice":28.875,"eps":0,"divideRate":0.04184,"volume":742,"delay":0,"ttmEps":0,"open":28.89,"prevYearClose":28.6248,"prevWeekClose":28.74,"prevMonthClose":28.7947,"prevQuarterClose":29.1161,"fiveDayClose":28.81,"twentyDayClose":29.2822,"sixtyDayClose":28.91},"$inf$@#url:\"https://stock-news.skytigris.cn/v2/news/list\",params:#symbols:\"GAA\",pageSize:20,pageCount:1,lang_content:\"cn\",edition:\"fundamental\",,,undefined,":[{"items":[{"id":"2530178774","title":"FinFET，走到盡頭，新王將登基！","url":"https://stock-news.laohu8.com/highlight/detail?id=2530178774","media":"半导体行业观察","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2530178774?lang=zh_tw&edition=fundamental","pubTime":"2025-04-28 09:49","pubTimestamp":1745804940,"startTime":"0","endTime":"0","summary":"换而言之，自英特尔在2009 年的开发者大会上推出了 22 纳米 FinFET 晶圆后，这个改变了芯片行业的设计，从某种程度看，走到了尽头。面对这些挑战，英特尔率先在22nm 引入了三位的FinFET工艺。该制程使用更小的晶体管，但具有相同的后端金属层，作为向 FinFET 过渡的过渡基石。英特尔坚称台积电20纳米工艺失败，因为它没有采用FinFET技术，而代工厂无法效仿英特尔，因为英特尔是IDM。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250428132334a6cb2b56&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250428132334a6cb2b56&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["LU0878005551.USD","LU0488056044.USD","SGXZ99366536.SGD","LU0158827781.USD","BK4602","BK4588","LU0823421416.USD","SGXZ81514606.USD","BK4605","BK4505","GAA","LU2491049909.HKD","LU1989772840.SGD","INTC","IE00B3M56506.USD","BK4581","BK4550","LU0143863784.USD","LU2028103732.USD","LU0158827948.USD","IE0004086264.USD","LU2054465674.USD","LU1623119135.USD","BK4585","LU2360032135.SGD","LU2471134796.USD","03145","LU2357125470.USD","LU1868838027.USD","LU0541502299.USD","LU2023250504.SGD","LU2133065610.SGD","BK4575","LU0094547139.USD","TSM","LU0109392836.USD","LU0082616367.USD","IE00BYQQ9H92.USD","BK4543","LU0878004406.USD","LU2089283258.USD","LU2458330243.SGD","LU2249611893.SGD","BK4533","IE00BQXX3C00.GBP","BK4141","SG9999004220.SGD","LU1989772923.USD","LU0572939691.SGD","LU2211815571.USD"],"gpt_icon":1},{"id":"2529472076","title":"臺積電公佈A14製程工藝：第二代GAA晶體管，計劃2028年投產","url":"https://stock-news.laohu8.com/highlight/detail?id=2529472076","media":"极客怪咖","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2529472076?lang=zh_tw&edition=fundamental","pubTime":"2025-04-24 10:36","pubTimestamp":1745462160,"startTime":"0","endTime":"0","summary":"近日台积电举办了2025年北美技术论坛，公布了下一代A14制程工艺，相比于N2带来了重大进步，旨在通过提供更快的计算和更高的能效来推动人工智能转型。A14制程工艺计划2028年投产，目前的开发进展顺利，良品率比预期的要高。A14制程工艺将采用第二代GAA晶体管，并通过NanoFlex Pro技术进一步提高灵活性。不过首发的A14制程工艺不支持超级电轨架构，也就是背面供电技术，台积电会在2029年带来加入背面供电的版本，满足高性能客户端和数据中心应用的需求。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.ifeng.com/c/8ioLPT8DMct","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"fenghuang_stock","symbols":["BK4505","LU0823414551.USD","LU2458330169.SGD","LU2023251221.USD","BK4526","BK4548","LU1282649067.USD","LU1974910355.USD","IE00BQXX3F31.USD","IE0004445239.USD","LU0719512351.SGD","GAA","LU1989772923.USD","LU1508157978.USD","LU2750360997.AUD","SG9999004220.SGD","LU2294711713.HKD","LU2237443978.SGD","LU0488056044.USD","BK4503","LU0094547139.USD","IE0004086264.USD","LU0056508442.USD","LU0353189680.USD","LU0882747503.HKD","LU2271345857.HKD","LU0264606111.USD","LU2663582299.SGD","03145","LU0823414478.USD","LU0082616367.USD","LU0823421416.USD","LU0158827781.USD","BK4512","LU0384037296.USD","LU2237443382.USD","LU0823421333.USD","LU2087625088.SGD","BK4554","SGXZ81514606.USD","IE00BHPRN162.USD","LU1868837722.USD","LU0316494557.USD","LU0878005551.USD","LU1623119135.USD","LU2211815571.USD","TSM","LU2106854487.HKD","LU2491049909.HKD","BK4527"],"gpt_icon":1},{"id":"2527251566","title":"黃仁勳預測：GAA技術助力NVIDIA新GPU，2028年性能提升20%，未來科技觸手可及","url":"https://stock-news.laohu8.com/highlight/detail?id=2527251566","media":"极客网","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2527251566?lang=zh_tw&edition=fundamental","pubTime":"2025-04-16 15:07","pubTimestamp":1744787239,"startTime":"0","endTime":"0","summary":"标题：黄仁勋预测：GAA技术助力NVIDIA新GPU，2028年性能提升20%，未来科技触手可及近日，在GTC 2025大会的访谈中，NVIDIA首席执行官黄仁勋表示，基于环绕栅极晶体管的下一代制程技术将为新一代GPU带来约20%的性能提升。这表明NVIDIA正在寻求在保持性能的同时，降低生产成本和时间。综上所述，黄仁勋预测的GAA技术助力NVIDIA新GPU，2028年性能提升20%，这一预测为我们揭示了未来科技的发展方向。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025041615072894d715a0&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025041615072894d715a0&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["NVDS.UK","NVDA","NVDU","LU2242649171.HKD","IE00BYXW3230.USD","LU2471134796.USD","SNVD.UK","LU1868836757.USD","LU0868494617.USD","LU2417539215.USD","IE00BMPRXR70.SGD","LU0061474960.USD","LU1244550221.USD","3NVD.UK","LU1084165304.USD","NVIW.SI","NVDY","IE0005OL40V9.USD","NVDS","NVD3.UK","LU1935043023.USD","LU2471134523.USD","IE00B19Z8X17.USD","LU1623119135.USD","LU0053666078.USD","LU0234572021.USD","LU0061474705.USD","LU0234570918.USD","LU2458330243.SGD","LU2552382058.USD","IE0004445015.USD","GAA","BK4527","NVD2.UK","LU2237957902.USD","NVDD","LU0787776722.HKD","LU1861220033.SGD","LU2552382132.HKD","BK4567","LU1951198990.SGD","LU0320765059.SGD","LU1551013425.SGD","LU2264538146.SGD","2NVD.UK","LU2237438978.USD","LU2461242641.AUD"],"gpt_icon":1},{"id":"2524329772","title":"2nm戰場，好戲來了","url":"https://stock-news.laohu8.com/highlight/detail?id=2524329772","media":"Ofweek维科网","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2524329772?lang=zh_tw&edition=fundamental","pubTime":"2025-04-03 18:18","pubTimestamp":1743675500,"startTime":"0","endTime":"0","summary":"台积电此前表示，2nm芯片将于4月1日起接受订单预订。想必2nm大规模量产之际，需求也会十分火爆。不过也有市场消息称台积电2nm制程的首批产能已被苹果预订，用于生产A20处理器。022nm战场，好戏来了在先进制程的赛道上，3nm 制程的热度还未完全消退，2nm 制程的角逐已正式开启。2nm的市场，好戏正在开演。据悉，Intel将在2025年下半年扩大Intel 18A的产量。据悉，这款备受期待的Exynos芯片将率先采用三星最新的2nm工艺制程，命名为SF2。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250403181854972d6faf&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250403181854972d6faf&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["03165","BK4602","LU0345769128.USD","LU2063271972.USD","LU2236285917.USD","HP","LU1935042488.USD","LU2471134523.USD","03145","LU0541501648.USD","LU2458330169.SGD","LU2543165471.USD","BK4505","LU0053666078.USD","LU0124676726.USD","LU0878004406.USD","LU0965509283.SGD","LU1242518931.SGD","IE00B775SV38.USD","IE0004445015.USD","SG9999004220.SGD","GAA","IE00BJJMRX11.SGD","BK4575","IE00B3M56506.USD","LU0672654240.SGD","LU1839511570.USD","LU0786609619.USD","LU2168563687.JPY","INTC","MACW.SI","TSM","SG9999018865.SGD","IE00BHPRN162.USD","LU1868838027.USD","LU1162221912.USD","LU0345770993.USD","LU2430703251.USD","LU0878005551.USD","GFS","LU0251132253.USD","LU2028103732.USD","LU2125154778.USD","LU1366192091.USD","HD","BK4585","LU0345774391.USD","IE00BKVL7J92.USD"],"gpt_icon":1},{"id":"2522057463","title":"英偉達黃仁勳：GAA工藝或僅帶來20%性能提升，架構與軟件創新更為關鍵","url":"https://stock-news.laohu8.com/highlight/detail?id=2522057463","media":"IT之家","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2522057463?lang=zh_tw&edition=fundamental","pubTime":"2025-03-27 20:57","pubTimestamp":1743080231,"startTime":"0","endTime":"0","summary":"然而他同时强调，对于英伟达的GPU而言，最主要的性能飞跃源于公司自身的架构创新以及软件层面的突破。当被问及未来几代英伟达GPU架构时，黄仁勋提及，如果英伟达转向采用基于GAA晶体管的制程技术，应能实现约20%的性能增长。台积电自身对其首个GAA工艺节点N2的预期是，相较于其第二代3nm级工艺N3E，性能提升幅度在10%至15%之间。对比来看，黄仁勋对GAA带来的20%提升预期似乎比台积电更为乐观。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.ifeng.com/c/8i4QoYNZykq","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"fenghuang_stock","symbols":["NVDS","IE00B3M56506.USD","SG9999015945.SGD","LU2360106780.USD","LU2458330243.SGD","3NVD.UK","GAA","NVD3.UK","2NVD.UK","LU0965508806.USD","LU1066051498.USD","LU1989772840.SGD","SG9999015952.SGD","LU0868494617.USD","NVDS.UK","NVIW.SI","LU2237957902.USD","LU2471134523.USD","LU2458330169.SGD","LU0203201768.USD","LU1923623000.USD","IE00BZ1G4Q59.USD","LU1868836757.USD","LU1712237335.SGD","NVDA","SNVD.UK","LU2063271972.USD","SG9999015358.SGD","LU2092627202.USD","NVDY","NVD","LU0323591593.USD","NVD2.UK","IE0034235303.USD","SG9999015978.USD","SG9999004303.SGD","IE00B4JS1V06.HKD","LU1633808545.USD","LU2413666699.HKD","LU0057025933.USD","LU0061474960.USD","NVDX","HK0000320223.HKD","NVDU","LU2750360641.GBP","LU0175139822.USD","LU1914381329.SGD","NVDD","LU0348723411.USD"],"gpt_icon":1},{"id":"2522454377","title":"英偉達CEO黃仁勳：GAA晶體管或帶來20%性能提升 但架構創新仍是關鍵","url":"https://stock-news.laohu8.com/highlight/detail?id=2522454377","media":"DoNews","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2522454377?lang=zh_tw&edition=fundamental","pubTime":"2025-03-27 20:16","pubTimestamp":1743077762,"startTime":"0","endTime":"0","summary":"在近期GTC大会的问答环节中，英伟达CEO黄仁勋表示，采用全环绕栅极晶体管的下一代制程技术可能为处理器带来约20%的性能提升。然而，他强调，英伟达GPU的主要性能飞跃仍源于公司自身的架构创新和软件突破。未来，英伟达或将在2028年采用台积电N2P或A16工艺，进一步优化性能。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025032720192094c2dca7&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025032720192094c2dca7&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["LU2237957811.SGD","LU0719512351.SGD","LU2236285917.USD","NVD","NVDS.UK","BK4503","LU1116320901.HKD","NVDX","LU1852331112.SGD","LU2087625088.SGD","IE00B1BXHZ80.USD","SNVD.UK","BK4588","LU0187121727.USD","LU0444973449.USD","LU0942090050.USD","LU1037948541.HKD","LU2065170008.USD","IE00BDCRKT87.USD","LU1791710400.SGD","NVD2.UK","GB00BDT5M118.USD","NVDS","NVD3.UK","LU0787776722.HKD","LU2458330243.SGD","LU2065169927.USD","NVDY","LU0882574139.USD","IE00BJTD4V19.USD","LU0170899867.USD","LU1066051225.USD","LU1242518931.SGD","LU1814569148.SGD","NVDU","SG9999014575.USD","GAA","LU1037948897.HKD","LU0347712357.USD","3NVD.UK","NVIW.SI","LU2242649171.HKD","NVDA","LU0823421416.USD","NVDD","TSM","2NVD.UK","LU1923622291.USD","LU1989772923.USD","BK4534"],"gpt_icon":0},{"id":"2521718377","title":"三星全力研發Exynos 2600芯片確保Galaxy S26系列按時上市","url":"https://stock-news.laohu8.com/highlight/detail?id=2521718377","media":"中关村在线","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2521718377?lang=zh_tw&edition=fundamental","pubTime":"2025-03-24 16:41","pubTimestamp":1742805668,"startTime":"0","endTime":"0","summary":"3月24日的消息显示，据韩国媒体报道，三星正全力以赴推动Exynos 2600芯片的研发工作。然而，为了确保三星Galaxy S26系列手机能够按时上市，三星需要在2025年第三季度中期完成Exynos 2600芯片的设计定型工作。此外，据报道，近期曝光的下一代芯片Exynos 2500的具体定位仍不明确。同时，有消息称“Exynos 2500的生产计划一直在调整”。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202503241718589721411a&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202503241718589721411a&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["LU2023250504.SGD","SG9999015945.SGD","LU0942090050.USD","IE00BSNM7G36.USD","BK4581","IE00BVYPNQ40.USD","BK4527","QCOM","SG9999015986.USD","BK4575","BK4515","LU1974910355.USD","LU1084165304.USD","SG9999001424.SGD","GAA","LU1823568750.SGD","BK4534","BK4588","LU1261432733.SGD","BK4579","SG9999015952.SGD","BK4604","LU1917777945.USD","LU1046421795.USD","LU2247934214.USD","BK4585","LU0061475181.USD","BK4561","BK4554","BK4612","IE00BGHQDM52.EUR","LU2106854487.HKD","SG9999015978.USD","GB00BDT5M118.USD","BK4605","BK4573","IE00BVYPNP33.GBP","LU0868494617.USD","LU1119994496.HKD","LU1069344957.HKD","BK4532","BK4141","LU0868494708.USD","LU1035775433.USD","LU0079474960.USD","BK4512"],"gpt_icon":0},{"id":"2519807375","title":"2nm工藝大考倒計時","url":"https://stock-news.laohu8.com/highlight/detail?id=2519807375","media":"爱集微","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2519807375?lang=zh_tw&edition=fundamental","pubTime":"2025-03-14 21:28","pubTimestamp":1741958901,"startTime":"0","endTime":"0","summary":"2025年，是先进制程代工厂交付2nm及以下工艺的时间点。这些技术的综合使用，让台积电的2nm工艺技术在性能提升和功耗降低方面展现出显著的优势。三星认为，公司的2nm工艺与前代工艺相比，其计算性能得到了显著提升。此外，三星官方数据显示，采用2nm工艺后，晶圆的利用率提高了约20%，有效降低了芯片的制造成本，使得三星在市场竞争中更具价格优势。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250314212846964551cf&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250314212846964551cf&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["IE00BQXX3C00.GBP","LU2357125470.USD","LU2249611893.SGD","LU0094547139.USD","BK4605","LU2360106780.USD","LU1508157978.USD","LU0882747503.HKD","BK4512","LU2750360641.GBP","SG9999000418.SGD","LU2471134523.USD","LU0823414478.USD","SGXZ99366536.SGD","LU1211504680.USD","LU2237443549.SGD","03165","LU0321505439.SGD","BK4585","LU0143863198.USD","LU1778281490.HKD","BK4612","LU2237443382.USD","IE00BYQQ9H92.USD","LU1712237335.SGD","LU2491050154.USD","LU0689626769.HKD","LU0792757196.USD","LU2506951792.HKD","LU1989764664.SGD","LU2458330169.SGD","TSM","IE0004086264.USD","03145","LU1430594728.SGD","LU2471134796.USD","LU0541501648.USD","IBM","LU1585245621.USD","LU2125154935.USD","LU1880398471.USD","LU0353189680.USD","GAA","LU2471134879.HKD","BK4526","LU2089283258.USD","LU1880398554.USD","LU0889565833.HKD","INTC"],"gpt_icon":1},{"id":"2519801828","title":"1nm，重要進展","url":"https://stock-news.laohu8.com/highlight/detail?id=2519801828","media":"半导体芯闻","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2519801828?lang=zh_tw&edition=fundamental","pubTime":"2025-03-14 18:23","pubTimestamp":1741947802,"startTime":"0","endTime":"0","summary":"报道指出，此举专注于 2nm 以下工艺技术，这些技术将需要 ASML 最新的光刻技术、计量和检测工具。台积电将建设 1nm超级晶圆厂与此同时，早前消息披露，台积电已经在台湾组件团队，加快1纳米研发。尽管台积电此前已宣布其 1 纳米工艺计划，但这是其首次透露有关其生产线位置和规模的具体细节。DNP表示，要实现2nm以后EUV光刻的光掩模版，需要的图案比3nm要小20%。DNP在成熟的3nm制程工艺基础上，通过反复改进，已经达到了2nm以后所需的图案分辨率。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.ifeng.com/c/8hinHv5Phc3","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"fenghuang_stock","symbols":["LU1712237335.SGD","LU0384037296.USD","03165","LU0878004406.USD","LU1917777945.USD","LU2750360641.GBP","LU0143863198.USD","IE00BQXX3F31.USD","LU2023250504.SGD","IE0004086264.USD","LU0143863784.USD","SCTO","ASML","LU0353189680.USD","LU1989772923.USD","LU2360106780.USD","BK4605","LU0316494557.USD","LU0792757196.USD","IE0004091025.USD","LU2271345857.HKD","LU2023251221.USD","BK4141","LU2028103732.USD","LU0823421333.USD","LU0572940350.SGD","DNP","LU2294711713.HKD","LU0264606111.USD","NA","LU0541501648.USD","LU1852331112.SGD","LU1508157978.USD","BK4515","LU2211815571.USD","IE00B5TLWC47.USD","LU0321505868.SGD","LU1989764664.SGD","IE00B3M56506.USD","LU0321505439.SGD","LU2360032135.SGD","INTC","BK4550","TSM","LU0348723411.USD","LU0889566641.SGD","GAA","LU0158827781.USD","03145","LU1868838027.USD"],"gpt_icon":1},{"id":"2505356580","title":"晶圓廠，大砍資本支出","url":"https://stock-news.laohu8.com/highlight/detail?id=2505356580","media":"虎嗅","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2505356580?lang=zh_tw&edition=fundamental","pubTime":"2025-01-23 10:01","pubTimestamp":1737597660,"startTime":"0","endTime":"0","summary":"基于上述种种考虑，出现了前文所谈到的三星削减资本支出计划。韩媒指出，三星晶圆厂将2025年的设施投资预算设定为5万亿韩元左右，较2024年的10万亿韩元投资范围大幅下降。联电大砍37.93％资本支出作为行业领先的另一家晶圆代工厂，联电在2024年全年每股盈余为3.79元，相比2023年的4.93元减少，创近4年新低。展望未来，2025年资本支出预算规划18亿美元，低于去年的29亿美元，年减37.93％，联电预期本季毛利率将降至逾25％水准，同步下探4年新低。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250123104237987000a9&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250123104237987000a9&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["LU1989764748.USD","LU1868837722.USD","LU0792757196.USD","LU0488056044.USD","SG9999000418.SGD","LU2491050154.USD","LU0384037296.USD","LU2237443978.SGD","GAA","LU1211504680.USD","LU2237443549.SGD","IE00BQXX3F31.USD","LU2294711713.HKD","BK4548","LU0823414478.USD","LU1989764664.SGD","LU1282649067.USD","LU0143863784.USD","LU2054465674.USD","LU1623119135.USD","LU0889566641.SGD","LU2458330169.SGD","LU2360032135.SGD","03145","BK4532","LU0823414551.USD","LU2360106780.USD","LU1712237335.SGD","LU2125154935.USD","LU0541502299.USD","LU0316494557.USD","LU0719512351.SGD","LU0094547139.USD","TSM","LU0109392836.USD","LU0082616367.USD","IE00BYQQ9H92.USD","BK4543","LU0348723411.USD","LU2458330243.SGD","UMC","IE00BQXX3C00.GBP","LU2237443622.USD","BK4512","BK4141","LU0143863198.USD","LU0264606111.USD","BK4526","LU2663582299.SGD","EPS"],"gpt_icon":1},{"id":"2505758108","title":"2nm工藝取得突破 Rapidus與IBM合作成功製造GAA晶體管原型晶圓","url":"https://stock-news.laohu8.com/highlight/detail?id=2505758108","media":"ZOL中关村在线","labels":["corporation"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2505758108?lang=zh_tw&edition=fundamental","pubTime":"2025-01-21 15:21","pubTimestamp":1737444094,"startTime":"0","endTime":"0","summary":"1月21日，据外媒报道，日本先进半导体制造商Rapidus与IBM合作在美国纽约州奥尔巴尼的纳米技术综合体制造了2nm GAA（全环绕栅极）晶体管原型晶圆。此次展示表明Rapidus和IBM具备制备2nm先进工艺芯片的实力。然而，从技术验证成功到商业化量产还面临长期而困难的过程。值得一提的是，Rapidus于2024年12月18日接收了首台在日本本土使用的EUV光刻机ASML NXE:3800E。试生产将在今年4月开始，在其位于北海道千岁市的IIM-1晶圆厂进行。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"sina_tech","url":"https://tech.sina.cn/mobile/xp/2025-01-22/detail-ineftrwv8523534.d.html?vt=4","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}.weibo_user{#sourceStyle#; margin-bottom: 0; display: inline-block;}.weibo_time{#sourceStyle#};","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, .action, .j_float_wbro, .j_article_wbreco","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.sina.cn/mobile/xp/2025-01-22/detail-ineftrwv8523534.d.html?vt=4","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"sina_tech","symbols":["LU1674673691.USD","BK4585","BK4602","LU1430594728.SGD","BK4534","LU1880398471.USD","LU1883839398.USD","LU1778281490.HKD","GAA","BK4543","LU0321505868.SGD","LU1674673428.USD","LU1585245621.USD","BK4575","BK4134","BK4533","LU0868494617.USD","BK4538","BK4588","LU1880398554.USD","IBM","BK4579","LU0321505439.SGD"],"gpt_icon":0},{"id":"2505758173","title":"Rapidus 與 IBM 合作在美製造 2nm GAA 原型晶圓亮相，在日試產 4 月啓動","url":"https://stock-news.laohu8.com/highlight/detail?id=2505758173","media":"IT之家","labels":["corporation"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2505758173?lang=zh_tw&edition=fundamental","pubTime":"2025-01-21 14:45","pubTimestamp":1737441936,"startTime":"0","endTime":"0","summary":"IT之家 1 月 21 日消息，据日媒 EE Times Japan 报道，日本先进半导体制造商 Rapidus在 2024 年 12 月 11~13 日举行的 SEMICON Japen 2024 上，展示了其与 IBM 合作在美国纽约州奥尔巴尼纳米技术综合体制造的 2nm GAA 晶体管原型晶圆。该晶圆的出现对外表明 Rapidus 与 IBM 这对技术伙伴的确具备制得 2nm 先进制程晶圆的实力，不过从制程技术验证成功到商业化量产尚需相当漫长而困难的一段爬坡之路。","market":"us","thumbnail":"https://k.sinaimg.cn/n/spider20250121/732/w1920h1212/20250121/f8ff-0f01881f4d85a0c8390a5acf38385b91.jpg/w120h90l50t1475.jpg","type":0,"news_type":0,"thumbnails":["https://k.sinaimg.cn/n/spider20250121/732/w1920h1212/20250121/f8ff-0f01881f4d85a0c8390a5acf38385b91.jpg/w120h90l50t1475.jpg"],"rights":{"source":"sina_tech","url":"https://tech.sina.cn/mobile/xp/2025-01-22/detail-ineftmqz7996480.d.html?vt=4","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}.weibo_user{#sourceStyle#; margin-bottom: 0; display: inline-block;}.weibo_time{#sourceStyle#};","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, .action, .j_float_wbro, .j_article_wbreco","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.sina.cn/mobile/xp/2025-01-22/detail-ineftmqz7996480.d.html?vt=4","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"sina_tech","symbols":["LU1880398471.USD","LU1674673428.USD","IBM","LU1585245621.USD","BK4134","LU1880398554.USD","BK4588","BK4602","BK4538","LU1430594728.SGD","LU1778281490.HKD","LU0321505439.SGD","LU0868494617.USD","BK4543","BK4585","BK4579","LU1883839398.USD","GAA","BK4575","LU1674673691.USD","LU0321505868.SGD","BK4533","BK4534"],"gpt_icon":0},{"id":"2504412837","title":"2nm，要來了","url":"https://stock-news.laohu8.com/highlight/detail?id=2504412837","media":"Ofweek光电信息网","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2504412837?lang=zh_tw&edition=fundamental","pubTime":"2025-01-20 09:00","pubTimestamp":1737334800,"startTime":"0","endTime":"0","summary":"N2 技术采用该公司第一代nm片晶体管技术，在性能和功耗方面实现了全节点跨越，预计今年实现量产。台积电强调，其 2nm 工艺的性能提高了 15%，功耗降低了 30%，显著提高了节点效率。目前台积电最大的客户苹果已在其工厂预留了 2nm 芯片生产，这让苹果相对于业内其他公司占据了优势。此外，三星正在与英伟达和高通等大型科技公司合作测试 2nm 工艺，这些公司正在多元化其代工合作伙伴，三星预计将于 2025 年第一季度开始试产 2nm 工艺。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250120091452986c13c8&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250120091452986c13c8&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["BK4512","LU0965509010.AUD","GAA","LU2054465674.USD","IE00B775H168.HKD","NVIW.SI","NVDY","NVDX","LU1582986359.USD","LU2462157665.USD","3NVD.UK","LU0175139822.USD","IE00BHPRN162.USD","03145","LU2023250504.SGD","LU2413666426.HKD","NVDD","LU1145028129.USD","NVDS","LU2063271972.USD","TSM","NVDA","IE00BMPRXQ63.HKD","SNVD.UK","LU0069063385.USD","QCOM","LU2602419157.SGD","LU1069344957.HKD","NVD2.UK","MACW.SI","PFN","NVDU","IE00B4YYXB79.USD","INTC","NVD3.UK","LU2023250843.SGD","SG9999015978.USD","LU0861579265.USD","LU0949170426.SGD","LU1868837565.USD","LU1852331112.SGD","LU1244550221.USD","LU0488056044.USD","SGXZ81514606.USD","2NVD.UK","NVDS.UK","NVD","BK4581","AAPL"],"gpt_icon":1},{"id":"2504187873","title":"晶圓代工釋放新信號","url":"https://stock-news.laohu8.com/highlight/detail?id=2504187873","media":"全球半导体观察","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2504187873?lang=zh_tw&edition=fundamental","pubTime":"2025-01-17 15:57","pubTimestamp":1737100631,"startTime":"0","endTime":"0","summary":"全球晶圆代工龙头台积电最新财报亮眼。晶圆代工大厂，再出新招全球市场研究机构TrendForce集邦咨询数据显示，在2024年第三季度的全球晶圆代工领域，台积电以64.9%的市占率一骑绝尘，稳居榜首；三星则以9.3%的份额紧随其后，位列第二；中芯国际、联电、格芯等企业也在竞争格局中占据一席之地。近期，晶圆代工行业的两大巨头——三星和台积电，均有新动态传出。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250117155913a2254ca8&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250117155913a2254ca8&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["03145","LU0541501648.USD","LU0143863784.USD","IE00BD6J9T35.USD","LU2294711713.HKD","LU0353189680.USD","LU0056508442.USD","LU0823421416.USD","LU2237443978.SGD","IE00BQXX3F31.USD","LU0889566641.SGD","IE00B3M56506.USD","LU2360032135.SGD","LU2491050154.USD","LU2357125470.USD","LU1803068979.SGD","LU0488056044.USD","BK4554","GAA","IE00BQXX3D17.EUR","BK4548","LU0109392836.USD","LU0823414478.USD","IE00B5TLWC47.USD","LU0572939691.SGD","BK4532","BK4505","IE0004445239.USD","BK4550","LU1852331112.SGD","LU0823421333.USD","IE00BYQQ9H92.USD","LU2133065610.SGD","LU2249611893.SGD","BK4527","TSM","LU2250418816.HKD","BK4543","LU1868837565.USD","BK4591","LU2237443622.USD","LU1282649810.SGD","LU0889565833.HKD","LU2087625088.SGD","IE00BQXX3C00.GBP","LU0719512351.SGD","LU2237443549.SGD","LU2458330243.SGD","LU1508157978.USD","LU0541502299.USD"],"gpt_icon":1},{"id":"2494090579","title":"0.7nm工藝，最新分享","url":"https://stock-news.laohu8.com/highlight/detail?id=2494090579","media":"半导体行业观察","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2494090579?lang=zh_tw&edition=fundamental","pubTime":"2024-12-25 14:04","pubTimestamp":1735106697,"startTime":"0","endTime":"0","summary":"要将 CFET 晶体管移至传导通道长度低于 10nm 的 A2 晶体管技术节点，Si 沟道的厚度也应缩小到 10nm 以下。在这些半导体中，原子排列在层状晶体中，单层厚度仅为 ~0.7nm，从而允许非常薄的沟道。同时，需要提高可靠性并大大降低可变性。为了减少引入 2D 材料的工作量和预期成本，imec选择将它们分阶段引入不太先进的节点和性能较低的设备中。imec开始将模块开发和 300 毫米晶圆工艺开发重点放在平面 2D 设备上。imec 研究人员的模拟表明，具有 MX2","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.ifeng.com/c/8fb0Q11RGqd","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"fenghuang_stock","symbols":["GAA","ALD"],"gpt_icon":0},{"id":"2493071742","title":"半導體未來三大支柱：先進封裝、晶體管和互連","url":"https://stock-news.laohu8.com/highlight/detail?id=2493071742","media":"赛迪网","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2493071742?lang=zh_tw&edition=fundamental","pubTime":"2024-12-24 09:33","pubTimestamp":1735003983,"startTime":"0","endTime":"0","summary":"在这些前沿技术中，三个核心领域尤为值得关注：面向AI发展的先进封装、晶体管微缩技术和互连微缩技术。因此，未来需要的是新型晶体管。互连缩放的突破：钌线路随着晶体管和封装技术的持续微缩，互连已成为半导体体系中的第三个关键要素。这些互连导线负责连接数以万亿计的晶体管。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241224101726a2064170&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241224101726a2064170&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["BK4535","BK4512","BK4141","BK4585","BK4588","BK4515","BK4121","BK4527","LU0321505868.SGD","BK4554","BK4529","LU0321505439.SGD","BK4602","BK4550","INTC","BK4579","BK4533","BK4575","GAA","LU0081259029.USD","BK4534"],"gpt_icon":1},{"id":"2491541942","title":"2nm，勝負已分？","url":"https://stock-news.laohu8.com/highlight/detail?id=2491541942","media":"华尔街见闻","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2491541942?lang=zh_tw&edition=fundamental","pubTime":"2024-12-15 13:30","pubTimestamp":1734240628,"startTime":"0","endTime":"0","summary":"但是，从现状看来，这场围绕着2nm的“大战”胜负已分，台积电有望成为唯一的赢家。台积电，打响头炮最近，有关台积电2nm的消息频发。其次，在本日前，有消息透露，台积电2nm 工艺试产成功，良率达60%。早前有报道指出，台积电每片2nm晶圆的成本高达30000美金。相关报道指出，苹果和AMD有望成为台积电2nm的首批客户。从上述可以看到，这些知名Fabless大多都会选择台积电作为他们的首选，这也正是我们认为“2nm，胜负已分”的原因。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241215133109ab792cd5&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241215133109ab792cd5&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["LU1923623000.USD","IE0004086264.USD","BK4527","IFS","BK4585","BK4503","LU1064131342.USD","LU2360106780.USD","LU2237443978.SGD","LU0823421333.USD","IE0009356076.USD","LU0082616367.USD","IE00B5TLWC47.USD","LU2264538146.SGD","GAA","LU1303367103.USD","BK4526","LU1868837565.USD","PFN","BK4588","BK4141","IE00BQXX3C00.GBP","03145","LU1803068979.SGD","LU0198837287.USD"],"gpt_icon":1},{"id":"2490958010","title":"中國芯片出口額，突破萬億","url":"https://stock-news.laohu8.com/highlight/detail?id=2490958010","media":"华尔街见闻","labels":["economic"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2490958010?lang=zh_tw&edition=fundamental","pubTime":"2024-12-10 18:55","pubTimestamp":1733828153,"startTime":"0","endTime":"0","summary":"前11个月，我国自动数据处理设备及其零部件、集成电路和汽车出口呈两位数增长。集成电路出口额首次突破万亿元大关。","market":"us","thumbnail":"https://wpimg-wscn.awtmt.com/9e2d8f4a-b42b-42ce-a71f-50c4e76d0273.png","type":0,"news_type":0,"thumbnails":["https://wpimg-wscn.awtmt.com/9e2d8f4a-b42b-42ce-a71f-50c4e76d0273.png"],"rights":{"source":"wallstreetcn_hot_news","url":"https://wallstreetcn.com/articles/3736602","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://wallstreetcn.com/articles/3736602","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"economic","news_rank":0,"length":0,"strategy_id":0,"source":"wallstreetcn_hot_news","symbols":["GAA","SEMI"],"gpt_icon":0},{"id":"2480881582","title":"SRAM，還沒死！","url":"https://stock-news.laohu8.com/highlight/detail?id=2480881582","media":"半导体行业观察","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2480881582?lang=zh_tw&edition=fundamental","pubTime":"2024-11-02 12:07","pubTimestamp":1730520440,"startTime":"0","endTime":"0","summary":"借助 N2，台积电终于成功缩小了 HD SRAM 位单元大小，从而提高了 SRAM 密度。台积电的 GAA 纳米片晶体管似乎是缩小 HD SRAM 位单元尺寸的主要推动因素。展望未来，对缓存和 SRAM 的需求将继续增长，因此台积电在 SRAM 单元尺寸方面的成就具有非常重要的意义。截至 2024 年 3 月，256 Mb SRAM 的平均良率已达到约 70%，较 2023 年 4 月的约 35% 大幅上升。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241102120952ab96d552&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241102120952ab96d552&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["BK4141","LU2237443978.SGD","IE0004091025.USD","LU1712237335.SGD","03145","LU0878005551.USD","BK4532","BK4581","LU1211504680.USD","LU2125154935.USD","IE00BQXX3F31.USD","LU2054465674.USD","IE00BQXX3C00.GBP","LU0488056044.USD","LU1989764664.SGD","LU0384037296.USD","BK4554","LU1868837722.USD","LU0348723411.USD","LU1868838027.USD","LU1989764748.USD","BK4548","IE0004086264.USD","TSM","LU2357125470.USD","BK4527","LU0264606111.USD","IE00B5TLWC47.USD","LU1623119135.USD","IE00BQXX3D17.EUR","BK4503","BK4526","LU1282649067.USD","BK4588","LU0572940350.SGD","LU0889566641.SGD","BK4591","LU1803068979.SGD","GAA","BK4534","LU0541501648.USD","LU2360032135.SGD","LU0143863198.USD","PPA","BK4585","LU1267930813.SGD","LU2249611893.SGD","LU0823421333.USD","IE00B3M56506.USD","BK4550"],"gpt_icon":1}],"pageSize":20,"totalPage":1,"pageCount":1,"totalSize":19,"code":"91000000","status":"200"}],"@#url:\"https://hq.skytigris.cn/fundamental/corporate_actions/details/GAA\",params:#limit:5,,,undefined,":[{"date":"2025-03-25","symbol":"GAA","amount":0.432705,"announcedDate":"2025-03-24","type":"dividend","lastAmount":null,"market":"US","newRecordDate":"2025-03-25","defaultRemindTime":1742909400000,"name":"Cambria Global Asset Allocation ETF","lastCurrency":null,"lastExecuteDate":null,"recordDate":"2025-03-26","payableDate":"2025-03-25","currency":"USD","dateTimestamp":1742875200000,"payDate":"2025-03-26"},{"date":"2024-12-23","symbol":"GAA","amount":0.03919674,"announcedDate":null,"type":"dividend","lastAmount":null,"market":"US","newRecordDate":"2024-12-23","defaultRemindTime":1734964200000,"name":"Cambria Global Asset Allocation ETF","lastCurrency":null,"lastExecuteDate":null,"recordDate":"2025-01-02","payableDate":"2024-12-23","currency":"USD","dateTimestamp":1734930000000,"payDate":"2025-01-02"},{"date":"2024-09-23","symbol":"GAA","amount":0.50913184,"announcedDate":null,"type":"dividend","lastAmount":null,"market":"US","newRecordDate":"2024-09-23","defaultRemindTime":1727098200000,"name":"Cambria Global Asset Allocation ETF","lastCurrency":null,"lastExecuteDate":null,"recordDate":"2024-10-02","payableDate":"2024-09-23","currency":"USD","dateTimestamp":1727064000000,"payDate":"2024-10-02"},{"date":"2024-06-24","symbol":"GAA","amount":0.22708427,"announcedDate":null,"type":"dividend","lastAmount":null,"market":"US","newRecordDate":"2024-06-24","defaultRemindTime":1719235800000,"name":"Cambria Global Asset Allocation ETF","lastCurrency":null,"lastExecuteDate":null,"recordDate":"2024-07-03","payableDate":"2024-06-24","currency":"USD","dateTimestamp":1719201600000,"payDate":"2024-07-03"},{"date":"2024-03-22","symbol":"GAA","amount":0.33481,"announcedDate":"2024-03-21","type":"dividend","market":"US","newRecordDate":"2024-03-25","defaultRemindTime":1711114200000,"name":"Cambria Global Asset Allocation ETF","recordDate":"2024-04-03","payableDate":"2024-03-25","currency":"USD","dateTimestamp":1711080000000,"payDate":"2024-04-03"}],"@#url:\"https://hq.skytigris.cn/fundamental/dividend/history\",params:#symbol:\"GAA\",market:\"US\",,,undefined,":[{"executeDate":"2015-06-26","recordDate":"2015-06-30","paymentDate":"2015-07-07","value":0.1127439,"currency":"USD"},{"executeDate":"2015-09-28","recordDate":"2015-09-30","paymentDate":"2015-10-06","value":0.229114,"currency":"USD"},{"executeDate":"2015-12-29","recordDate":"2015-12-31","paymentDate":"2016-01-05","value":0.001546,"currency":"USD"},{"executeDate":"2015-12-29","recordDate":"2015-12-31","paymentDate":"2016-01-05","value":0.164369,"currency":"USD"},{"executeDate":"2016-03-29","recordDate":"2016-03-31","paymentDate":"2016-04-07","value":0.0929959,"currency":"USD"}],"@#url:\"https://hq.skytigris.cn/fundamental/estimate/recommendation\",params:#symbol:\"GAA\",market:\"US\",delay:false,,,undefined,":{}}}