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美股
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本頁面由Tiger Trade Technology Pte. Ltd.提供服務
Cambria Global Asset Allocation ETF
33.98
+0.3325
0.99%
盤後:
33.98
-0.0025
-0.01%
16:10 EDT
成交量:
8,419.00
成交額:
28.63萬
市值:
6,711.55萬
市盈率:
- -
高:
34.12
開:
34.12
低:
33.89
收:
33.65
52周最高:
35.45
52周最低:
26.80
股本:
197.50萬
流通股本:
197.50萬
量比:
1.25
換手率:
0.43%
股息:
1.38
股息率:
4.06%
淨資產收益率:
--
總資產收益率:
--
市淨率:
--
市盈率(LYR):
- -
資料載入中...
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公司
新聞資訊
公告
三星發布全球首款2nm手機芯片——Exynos 2600
环球市场播报
·
2025/12/21
下一代半導體技術如何推動人工智能革命
电子产品世界
·
2025/12/02
2.1萬片/月!三星2nm產能明年增長163%
半导体新知道
·
2025/11/23
1.4nm工廠,低調開工
半导体芯闻
·
2025/11/05
又一座1.4nm工廠獲批,即將開工!
半导体封测
·
2025/11/02
未來三年,全球300毫米晶圓廠設備支出將突破3740億美元
半导体新知道
·
2025/10/15
芯片設備,最新預測
半导体行业观察
·
2025/10/10
2nm芯片,開打價格戰
半导体产业纵横
·
2025/09/28
「芯片需求讓人失望」
半导体行业观察
·
2025/09/24
中國設備企業,全球排名第七
半导体产业纵横
·
2025/09/18
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2600","url":"https://stock-news.laohu8.com/highlight/detail?id=2593127979","media":"环球市场播报","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2593127979?lang=zh_tw&edition=fundamental","pubTime":"2025-12-21 22:36","pubTimestamp":1766327760,"startTime":"0","endTime":"0","summary":"三星正式推出Exynos 2600 芯片。该芯片不仅是三星首款、更是全球首款 2 纳米移动芯片,采用三星晶圆代工的 2 纳米全环绕栅极工艺打造。通过创新的热传导技术,三星承诺这款全新Exynos芯片将具备更为出色的持续性能表现。与前代Exynos芯片不同,Exynos 2600未配备任何能效核心。三星称,相较于Exynos 2500,该芯片的 CPU 综合性能提升幅度达到 39%。 目前,Exynos 2600 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.wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251123133533a4b47faf&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["LU0878005551.USD","LU0353189680.USD","LU0541502299.USD","LU0823414478.USD","LU0965508806.USD","BK4605","IE00B5TLWC47.USD","SG9999004220.SGD","LU1868837722.USD","LU2250418816.HKD","LU0889565833.HKD","BK4526","LU0143863784.USD","LU2023250504.SGD","LU0289960550.SGD","LU0882747503.HKD","LU2491049909.HKD","LU0348723411.USD","LU0642271901.SGD","LU0384037296.USD","LU2357125470.USD","LU2023251221.USD","03145","LU2360032135.SGD","LU2237443549.SGD","TSM","LU0094547139.USD","IE00BHPRN162.USD","GAA","SGXZ99366536.SGD","LU0572939691.SGD","LU2089284900.SGD","LU1316542783.SGD","LU2360106780.USD","BK4581","LU2087625088.SGD","LU2237443382.USD","LU0541501648.USD","LU0823421333.USD","LU0572940350.SGD","LU2106854487.HKD","LU0198837287.USD","BK4533","BK4141","LU1989764748.USD","LU0353189763.USD","LU2663582299.SGD","LU2294711713.HKD","IE00BZ199S13.USD","LU0878004406.USD"],"gpt_icon":1},{"id":"2581796847","title":"1.4nm工廠,低調開工","url":"https://stock-news.laohu8.com/highlight/detail?id=2581796847","media":"半导体芯闻","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2581796847?lang=zh_tw&edition=fundamental","pubTime":"2025-11-05 18:28","pubTimestamp":1762338536,"startTime":"0","endTime":"0","summary":"台积电中科1.4纳米先进制程新厂5日迎动工,随着此计划正式启动,加上交通建设市政路延伸工程首段通车,整个“科技黄金走廊”再添强劲动能。台积电1.4nm技术解读台积电发布了其A14制程工艺,并承诺该工艺在性能、功耗和晶体管密度方面将比其N2工艺有显著提升。台积电预计A14将于2028年量产,但初期将不具备背面供电功能。台积电计划于2028年开始量产其A14工艺芯片,但并未透露具体会在上半年还是下半年启动A14的大规模生产。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251105224559a6e37da2&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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17:35","pubTimestamp":1762076104,"startTime":"0","endTime":"0","summary":"11月2日最新消息,台积电规模高达490亿美元的AI资本支出计划正式获批,其在台中建设A14工厂的申请也顺利通过审核。这座备受瞩目的工厂将聚焦1.4纳米芯片的制造,标志着台积电在先进制程领域再次迈出关键一步。台积电已成功获得A14工厂及其附属设施的三张建造许可,为项目开工奠定了坚实基础。此次台积电A14工厂建设获批的消息引发媒体广泛关注,多家媒体以“台积电A14工厂建设获批,即将开工”为题进行报道。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251102173814a6db64ab&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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06:30","pubTimestamp":1760481044,"startTime":"0","endTime":"0","summary":"国际半导体产业协会最新发布的《300毫米晶圆厂展望》报告显示,2026年至2028年,全球300毫米晶圆厂设备支出将累计达3740亿美元。从整体趋势看,2025年将成为关键起点,全球300毫米晶圆厂设备支出预计首次突破1000亿美元大关,同比增长7%至1070亿美元;随后三年将持续攀升,2026年增长9%至1160亿美元,2027年增长4%至1200亿美元,2028年更将大幅增长15%至1380亿美元。内存领域紧随其后,三年总支出预计达1360亿美元,开启新一轮增长周期。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251015063215a460377c&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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17:47","pubTimestamp":1758188868,"startTime":"0","endTime":"0","summary":"北方华创作为Top10中唯一的中国半导体设备厂商,2023年首次进入全球Top10,2024年排名由第八上升至第六,1H'25营收约22亿美元,排名降至第七。2026年,后端设备领域扩张势头将继续,测试设备销售额预计增长5.0%,封装设备销售额预计增长15.0%,实现连续三年增长。中国大陆在预测期内将继续领跑所有地区,不过销售额预计将从2024年创纪录的495亿美元有所下降。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250918194409979af612&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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