美股詳情

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TCF Financial Corp

16.86

-0.1150-0.68%

成交量：90.15萬

成交額：1,519.91萬

市值：28.30億

市盈率：14.66

高：17.02

開：17.02

低：16.72

收：16.97

52周最高：20.03

52周最低：11.72

股本：1.68億

流通股本：1.57億

量比：- -

換手率：0.58%

股息：- -

股息率：- -

每股收益(TTM):1.15

淨資產收益率：--

總資產收益率：--

市淨率：1.16

市盈率(LYR):- -

資料載入中...

總覽公司新聞資訊公告

港股異動 | ASMPT(00522)升逾5% 小摩預計公司將上調TCB設備長期總潛在市場規模預期

存儲巨頭四季報「五大關鍵點」：當前周期強度超越2017-18「雲繁榮周期」

华尔街见闻

港股異動 | ASMPT(00522)早盤升逾4% SK海力士斥資300億韓元向ASMPT訂購TCB設備

【光大海外】ASMPT 25Q3：主流和SMT業務復甦，TCB設備預計25Q4和2026年出貨加速

光大證券：維持ASMPT(00522)「增持」評級 TCB設備預計25Q4和2026年出貨加速

先進封裝設備市場，風雲再起

先進封裝推動，後端芯片設備增長迅猛

半导体行业观察

ASMPT盤中升逾8% 公司上半年TCB設備訂單量增長50%

HBM的另一場內戰

禁止測試美國電子產品：FCC 撤銷 11 家中資背景實驗室資格，含中國信通院等

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15:05","pubTimestamp":1761807920,"startTime":"0","endTime":"0","summary":"智通财经APP获悉，光大证券发布研报称，维持ASMPT“增持”评级，AI需求强劲，主流业务和SMT恢复，TCB有望25Q4和2026年加速出货，但重组带来一次性费用，调整公司25-27年净利润预测至2.03/13.51/19.35亿港元，对应同比-41.2%/+565.2%/+43.2%。报告中称，公司深化布局TCB、HB，25Q4和26年有望出货加速：1)TCB方面，通过逻辑领域重要大客户验证，HBM4具备先发优势。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["rate"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1362631.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["601788","TCB","00522"],"gpt_icon":0},{"id":"2577877313","title":"先進封裝設備市場，風雲再起","url":"https://stock-news.laohu8.com/highlight/detail?id=2577877313","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2577877313?lang=zh_tw&edition=fundamental","pubTime":"2025-10-22 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08:59","pubTimestamp":1760403542,"startTime":"0","endTime":"0","summary":"预计2025年至2030年间，后端设备市场规模将从69亿美元增长至98亿美元，年复合增长率高达7.1%。倒装芯片键合机对传统和先进的高密度封装都至关重要，到2030年其市场规模将增长至6.62亿美元以上。预计到 2030 年，K&S 将保持强劲的市场领先地位，其收入将小幅增长至约 9.94 亿美元。主要市场参与者和投资后端设备技术的增长得益于 OSAT 供应商和 IDM 厂商的战略投资。到2030年，后端设备市场规模将超过90亿美元，这主要得益于7.1%的复合年增长率以及封装技术的变革。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251014091126a6b7f980&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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