港股詳情

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基本半導體待上市

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高：- -

開：- -

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52周最高：- -

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股本：3.04億

香港流通股本：2.88億

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1

开始申购

06/29

2

申購截止

07/03 10:15

3

公布中签

07/06

4

暗盘

07/07 16:15 - 18:30

5

挂牌上市

07/08

總覽公司新聞公告

新股消息 | 基本半導體(09971)招股結束超購約552.29倍一手入場費約6388港元

基本半導體7月8日登陸港交所，藍海華騰等A股公司位列股東名單

新股解讀|基本半導體（09971）：國配「鎖籌」缺失或加劇股價波動，產業復甦難解盈利困局

新股招股 | 基本半導體今起招股，一手入場費6387.78港元

老虎资讯综合

【新股IPO】基本半導體(099710)今日起招股入場費6387.78港元

基本半導體尋求在香港IPO中融資至多8.66億港元

基本半導體(09971)6月29日至7月3日招股擬全球發售2738.62萬股H股

新股消息：深圳基本半導體(09971)啓動全球發售，發售價區間每股27.49-31.62港元

基本半導體通過聆訊，衝擊港股碳化硅第一股

华尔街见闻

基本半導體，通過港交所聆訊，或很快香港上市 | TMT企業.IPO上市

港澳IPO上市

碳化硅的AI敍事與價值重估，基本半導體通過港交所聆訊

新股消息 | 基本半導體通過港交所聆訊專注於第三代功率半導體產業

基本半導體通過上市聆訊：年營收3億虧3.4億北京屹唐與廣汽智行是股東

中國首個「碳化硅芯片IPO」要來了

新股前瞻|三年累虧7.56億，基本半導體的「碳化硅故事」還有多少説服力？

新股消息 | 基本半導體三度遞表港交所 2024年收入在中國碳化硅功率模塊市場排名第六

基本半導體衝刺港股：年營收3億虧3億北京屹唐與廣汽智行是股東

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今日起招股，拟发行2738.62万股H股，其中5%为香港发售，95%为国际发售，另有15%超额配股权。每股发售价介乎27.49港元至31.62港元。每手200股，入场费6387.78港元。股份预期将于7月8日挂牌上市。约20.0%用于在未来五年内对新碳化硅产品的研发工作以及技术创新。","market":"us","thumbnail":"https://static.szfiu.com/news/20220324/ZjY2ZWM0MjU3NTE0MTk1OTA=.jpg","type":0,"news_type":0,"thumbnails":["https://static.szfiu.com/news/20220324/ZjY2ZWM0MjU3NTE0MTk1OTA=.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"1984647","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["09971","IPOS","EWH"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2647341333","title":"基本半導體尋求在香港IPO中融資至多8.66億港元","url":"https://stock-news.laohu8.com/highlight/detail?id=2647341333","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2647341333?lang=zh_tw&edition=fundamental","pubTime":"2026-06-29 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于2026年6月29日至2026年7月3日招股，该公司拟全球发售2738.62万股H股，其中香港公开发售占约5%，国际发售占约95%，另有15%超额配股权。每股发售价27.49-31.62港元。集团是中国第三代半导体功率器件行业的企业，专注于碳化硅功率器件的研发、制造及销售。假设超额配股权未获行使，经扣除集团就全球发售应付的承销佣金及其他预计发行费用，及假设发售价为每股股份29.56港元，集团预计将收取全球发售所得款项净额约7.13亿港元。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1460038.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["09971"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1159275418","title":"新股消息：深圳基本半導體(09971)啓動全球發售，發售價區間每股27.49-31.62港元","url":"https://stock-news.laohu8.com/highlight/detail?id=1159275418","media":"公告速递","labels":["shareholding","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1159275418?lang=zh_tw&edition=fundamental","pubTime":"2026-06-29 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17:55","pubTimestamp":1782208504,"startTime":"0","endTime":"0","summary":"但三年亏损逾9亿元。","market":"other","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://wallstreetcn.com/articles/3775296","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["09971"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2645889518","title":"基本半導體，通過港交所聆訊，或很快香港上市 | TMT企業.IPO上市","url":"https://stock-news.laohu8.com/highlight/detail?id=2645889518","media":"港澳IPO上市","labels":["corporation"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2645889518?lang=zh_tw&edition=fundamental","pubTime":"2026-06-23 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6月21日深圳基本半导体股份有限公司日前通过上市聆讯，准备在港交所上市。基本半导体2023年、2024年及2025年分别产生研发开支7580万元、9110万元及1.1亿元。基本半导体2023年、2024年、2025年年内亏损分别为3.42亿元、2.37亿元、3.35亿元；年内亏损率分别为155.1%、79.3%、107.7%。基本半导体2023年、2024年、2025年经调整净亏损分别为3.1亿元、2亿元、2.4亿元。截至2025年12月31日，基本半导体持有的现金及现金等价物为9868万。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://mp.weixin.qq.com/s?__biz=MjM5MzQ5NjIyMQ==&mid=2661676126&idx=1&sn=a335509599fb7a8ebb1030c23dcd121e&chksm=bdc779ac8ab0f0ba002fa88dbffbd8554c2c4ef875197b131588582d34cd70cba66dd6128160#rd","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["09971","159582"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2643075300","title":"中國首個「碳化硅芯片IPO」要來了","url":"https://stock-news.laohu8.com/highlight/detail?id=2643075300","media":"PE星球","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2643075300?lang=zh_tw&edition=fundamental","pubTime":"2026-06-15 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21:56","pubTimestamp":1780667771,"startTime":"0","endTime":"0","summary":"深圳基本半导体股份有限公司（简称：“基本半导体”）日前更新招股书，准备在港交所上市。","market":"sh","thumbnail":"https://leidinews-1256465536.cos.ap-chengdu.myqcloud.com/u_News/20260605/6391629335620559993880464.jpeg","type":0,"news_type":0,"thumbnails":["https://leidinews-1256465536.cos.ap-chengdu.myqcloud.com/u_News/20260605/6391629335620559993880464.jpeg"],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.leinews.com/n33939/detail.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"leinews_highlight","symbols":["BK0132","BK1119","BK0014","BK0224","BK1539","09971"],"isVideo":false,"video":null,"gpt_icon":0}],"pageSize":20,"totalPage":1,"pageCount":1,"totalSize":17,"code":"91000000","status":"200"}]}}